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ໃຫມ່ແລະຕົ້ນສະບັບ 10M08SCE144C8G ວົງຈອນປະສົມປະສານໃນຫຼັກຊັບ
ຄຸນລັກສະນະຂອງຜະລິດຕະພັນ ປະເພດ DESCRIPTION ໝວດໝູ່ວົງຈອນລວມ (ICs) FPGAs ທີ່ຝັງໄວ້ (Field Programmable Gate Array) Mfr Intel Series MAX® 10 Package Tray Product Status Active Number of LABs/CLBs 500 Number of Logic Elements/Cells 8000 Total RAM Bits 387/I. O 101 Voltage – Supply 2.85V ~ 3.465V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 144-LQFP Exposed Pad Device Package 144-EQFP (20×20) ... -
EP2S15F484C3N 484-FBGA (23×23) ວົງຈອນປະສົມປະສານ IC FPGA 342 I/O 484FBGA ເອເລັກໂຕຣນິກປະສົມປະສານ
Product Attributes TYPE DESCRIPTION Category Integrated Circuits (ICs) Embedded FPGAs (Field Programmable Gate Array) Mfr Intel Series Stratix® II Package Tray Standard Package 60 Product Status Obsolete Number of LABs/CLBs 780 Number of Logic Elements/Cells Total 15368 RAM of I/O 342 Voltage – Supply 1.15V ~ 1.25V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 484-BBGA Supplier Device Package 484-FB... -
New Original 10M08SAE144I7G integrated circuit fpga ic chip integrated circuit bga chips 10M08SAE144I7G
ຄຸນລັກສະນະຂອງຜະລິດຕະພັນ ປະເພດ DESCRIPTION ໝວດໝູ່ວົງຈອນລວມ (ICs) FPGAs ທີ່ຝັງໄວ້ (Field Programmable Gate Array) Mfr Intel Series MAX® 10 Package Tray Product Status Active Number of LABs/CLBs 500 Number of Logic Elements/Cells 8000 Total RAM Bits 387/I. O 101 Voltage – Supply 2.85V ~ 3.465V ປະເພດ Mounting Surface Mount ອຸນຫະພູມປະຕິບັດງານ -40°C ~ 100°C (TJ) Package / Case 144-LQFP Exposed Pad Device Package 144-EQFP (20×20)... -
ອົງປະກອບເອເລັກໂຕຣນິກໃຫມ່ 10M02SCM153I7G EN6337QA EP4SE530H40I3N EPM7128AETC144-7N Ic Chip
ຄຸນລັກສະນະຂອງຜະລິດຕະພັນ ປະເພດ DESCRIPTION ໝວດໝູ່ວົງຈອນລວມ (ICs) FPGAs ທີ່ຝັງໄວ້ (Field Programmable Gate Array) Mfr Intel Series MAX® 10 Package Tray Product Status Active Number of LABs/CLBs 125 Number of Logic Elements/Cells 2000 Total RAM Bits 110/110 O 112 Voltage – Supply 2.85V ~ 3.465V Mounting Type Surface Mount ອຸນຫະພູມປະຕິບັດການ -40°C ~ 100°C (TJ) Package / Case 153-VFBGA Supplier Device Package 153-MBGA (8×8) Report ... -
XC3S500E-5CP132C 132-CSPBGA (8×8) ວົງຈອນລວມ IC ຊິບເອເລັກໂຕຣນິກ FPGA 92 I/O 132CSBGA
Product Attribute ຜູ້ຜະລິດ: Xilinx ປະເພດຜະລິດຕະພັນ: FPGA – Field Programmable Gate Array Series: XC3S500E ຈໍານວນອົງປະກອບ Logic: 10476 LE ຈໍານວນ I/Os: 92 I/O ແຮງດັນການສະຫນອງການໃຊ້ງານ: 1.2 V ອຸນຫະພູມການເຮັດວຽກສູງສຸດ: 0 C. ອຸນຫະພູມ: + 85 C ຮູບແບບການຕິດຕັ້ງ: SMD/SMT Package / Case: CSBGA-132 ຍີ່ຫໍ້: Xilinx ອັດຕາຂໍ້ມູນ: 333 Mb/s RAM ແຈກຢາຍ: 73 kbit ຝັງ RAM ຕັນ – EBR: 360 kbit ປະຕິບັດການສູງສຸດ ... -
ອົງປະກອບເອເລັກໂຕຣນິກສະຫນັບສະຫນູນ BOM Quotation XC3S500E-4FTG256C IC FPGA 190 I/O 256FTBGA
ຄຸນລັກສະນະຂອງຜະລິດຕະພັນ DESCRIPTION ໝວດໝູ່ວົງຈອນລວມ (ICs) Embedded FPGAs (Field Programmable Gate Array) Mfr AMD Xilinx Series Spartan®-3E Package Tray Standard Package 90 Product Status Active Number of LABs/CLBs 1164 Number of Logic Elements/Cells 1 RAM Totals/Cells 368640 ຈໍານວນ I/O 190 ຈໍານວນ Gates 500000 Voltage – Supply 1.14V ~ 1.26V ປະເພດ Mounting Surface Mount ອຸນຫະພູມປະຕິບັດງານ 0°C ~ 85°C (TJ) Package / Case 256-LBGA S... -
ຊິບ IC ວົງຈອນປະສົມປະສານຫນຶ່ງຈຸດຊື້ EPM240T100C5N IC CPLD 192MC 4.7NS 100TQFP
Product Attributes TYPE DESCRIPTION Category Integrated Circuits (ICs) Embedded CPLDs (Complex Programmable Logic Devices) Mfr Intel Series MAX® II Package Tray Standard Package 90 Product Status Active Programmable Type In System Programmable Delay Time tpd(1) – Max 4.7 ns Voltage Supply 2.5V, 3.3V ຈໍານວນ Logic Elements/Blocks 240 ຈໍານວນ Macrocells 192 ຈໍານວນ I/O 80 ອຸນຫະພູມປະຕິບັດງານ 0°C ~ 85°C (TJ) ປະເພດ Mounting Surface Mount Pa... -
ສະຫນັບສະຫນູນຕົ້ນສະບັບ BOM chip ອົງປະກອບເອເລັກໂຕຣນິກ EP4SE360F35C3G IC FPGA 744 I/O 1152FBGA
Product Attributes TYPE DESCRIPTION Category Integrated Circuits (ICs) Embedded FPGAs (Field Programmable Gate Array) Mfr Intel Series * Package Tray Standard Package 24 Product Status Active Base Product Number EP4SE360 Intel ເປີດເຜີຍລາຍລະອຽດຊິບ 3D: ສາມາດ stacking 100 ຕື້ transistors, ວາງແຜນທີ່ຈະເປີດຕົວ ໃນປີ 2023 ຊິບ 3D stacked ເປັນທິດທາງໃຫມ່ຂອງ Intel ເພື່ອທ້າທາຍກົດຫມາຍຂອງ Moore ໂດຍການ stacking ອົງປະກອບຕາມເຫດຜົນໃນຊິບເພື່ອ incr ຢ່າງຫຼວງຫຼາຍ ... -
ໃໝ່ ແລະຕົ້ນສະບັບ EP4CE30F23C8 ຊິບ IC ວົງຈອນປະສົມປະສານ IC FPGA 328 I/O 484FBGA
Product Attributes TYPE DESCRIPTION Category Integrated Circuits (ICs) Embedded FPGAs (Field Programmable Gate Array) Mfr Intel Series Cyclone® IV E Package Tray Standard Package 60 Product Status Active Number of LABs/CLBs 1803 Number of Logic Elements/Cells 48 28 RAM Total ຈໍານວນ I/O 328 Voltage – Supply 1.15V ~ 1.25V ປະເພດ Mounting Surface Mount ອຸນຫະພູມປະຕິບັດງານ 0°C ~ 85°C (TJ) Package / Case 484-BGA Supplier Device Package 484-FB... -
IC ຕົ້ນສະບັບຂາຍຮ້ອນ EP2S90F1020I4N BGA Integrated Circuit IC FPGA 758 I/O 1020FBGA
Product Attributes TYPE DESCRIPTION Category Integrated Circuits (ICs) Embedded FPGAs (Field Programmable Gate Array) Mfr Intel Series Stratix® II Package Tray Standard Package 24 Product Status Obsolete Number of LABs/CLBs 4548 Number of Logic Elements/Cells 8 ຈໍານວນ RAM 60 ຈໍານວນ 904 ຈໍານວນທັງຫມົດ 8 ຈໍານວນ 909 ບິດ. of I/O 758 Voltage – Supply 1.15V ~ 1.25V ປະເພດ Mounting Surface Mount ອຸນຫະພູມປະຕິບັດງານ -40°C ~ 100°C (TJ) Package / Case 1020-BBGA Supplier Device Packag... -
EP2AGX65DF29I5N ອົງປະກອບອີເລັກໂທຣນິກຕົ້ນສະບັບໃຫມ່ປະສົມປະສານວົງຈອນມືອາຊີບຜູ້ສະຫນອງ IC
ຄຸນລັກສະນະຂອງຜະລິດຕະພັນ DESCRIPTION ໝວດໝູ່ວົງຈອນລວມ (ICs) Embedded FPGAs (Field Programmable Gate Array) Mfr Intel Series Arria II GX Package Tray Standard Package 36 Product Status Obsolete Number of LABs/CLBs 2530 ຈຳນວນຂອງ Logic Elements/Cells 4 ຈໍານວນ 602 RAM ທັງໝົດ 602 ໜ່ວຍ RAM of I/O 364 Voltage – Supply 0.87V ~ 0.93V ປະເພດ Mounting Surface Mount ອຸນຫະພູມປະຕິບັດງານ -40°C ~ 100°C (TJ) Package / Case 780-BBGA, FCBGA Supplier De... -
ວົງຈອນປະສົມປະສານ EP2AGX45DF29C6G ອົງປະກອບເອເລັກໂຕຣນິກ ic chips ຫນຶ່ງຈຸດຊື້ IC FPGA 364 I/O 780FBGA
ຄຸນລັກສະນະຂອງຜະລິດຕະພັນ DESCRIPTION ໝວດໝູ່ວົງຈອນລວມ (ICs) Embedded FPGAs (Field Programmable Gate Array) Mfr Intel Series Arria II GX Package Tray Standard Package 36 Product Status Active Number of LABs/CLBs 1805 Number of Logic Elements/Cells Total RAM 4744039 of I/O 364 Voltage – Supply 0.87V ~ 0.93V ປະເພດ Mounting Surface Mount ອຸນຫະພູມປະຕິບັດການ 0°C ~ 85°C (TJ) Package / Case 780-BBGA, FCBGA Supplier Device Package...
